| Ase Industrial Holding Ltd ADR (ASX) | |||
|---|---|---|---|
| 21.71 0.05 (0.23%) | 03-10 16:00 | ||
| Open: | 21.835 | Pre. Close: | 21.66 |
| High: | 22.2779 | Low: | 21.675 |
| Volume: | 5,536,891 | Market Cap: | 47,338(M) |
| Stock Technical Analysis | |
|---|---|
| Overall: |  |
| Target: | Six months: 26.45 One year: 29.54 |
| Support: | Support1: 18.37 Support2: 15.28 |
| Resistance: | Resistance1: 22.65 Resistance2: 25.29 |
| Pivot: | 23.17  |
| Moving Averages: | MA(5): 21.73 MA(20): 23.21 MA(100): 17.55  MA(250): 12.90 |
| MACD: | MACD(12,26): 0.38 Signal(12,26,9): 0.86 |
| %K %D: | %K(14,3): 18.12 %D(3): 14.08 |
| RSI: | RSI(14): 47.44 |
| 52-Week: | High: 25.29 Low: 6.94 Change(%): 137.5 |
| Average Vol(K): | 3-Month: 7968 10-Days: 8322 |
| Prices Prediction (Update @5:00pm) | ||
|---|---|---|
| If tomorrow: | Open lower | Open higher |
| High: | 22.318 - 22.425 | 22.425 - 22.521 |
| Low: | 21.406 - 21.531 | 21.531 - 21.644 |
| Close: | 21.508 - 21.71 | 21.71 - 21.892 |
| Price, MAs and Bollinger Bands |
|---|
| Price has closed below its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BULLISH in mid-long term.[ ASX ] has closed above bottom band by 20.1%. Bollinger Bands are 40.4% wider than normal. The large width of the bands suggest high volatility as compared to its normal range. The bands have been in this wide range for 0 days. This is a sign that the current trend might continue. |
| Company profile |
|---|
| ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan. |
| Stock chart |
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| Financial Analysis | |
|---|---|
| Price to Book Value: | Underperform |
| P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. | |
| Price to Earnings: | Underperform |
| PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). | |
| Discounted cash flow: | Neutral |
| DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. | |
| Return on Assets: | Outperform |
| ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. | |
| Return on Equity: | Outperform |
| ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. | |
| Debt to Equity: | Underperform |
| evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. | |
| Stock Basics & Statistics | |
|---|---|
| Exchange: New York Stock Exchange | |
| Sector: Technology | |
| Industry: Semiconductors | |
| Shares Out. (M) | 2190.00 |
| Shares Float (M) | 3120.00 |
| % Held by Insiders | |
| % Held by Institutions | 7.55 |
| Shares Short (K) | 5720 |
| Shares Short Prior Month (K) | 7620 |
| Stock Financials | |
|---|---|
| EPS | 0.560 |
| Book Value (p.s.) | 2.490 |
| Profit Margin | 6.30 |
| Operating Margin | 9.94 |
| Return on Assets (ttm) | 3.9 |
| Return on Equity (ttm) | 11.6 |
| Qtrly Rev. Growth | 9.6 |
| Gross Profit (p.s.) | 52.142 |
| Sales Per Share | 294.699 |
| EBITDA (p.s.) | 53.973 |
| Qtrly Earnings Growth | 57.30 |
| Operating Cash Flow (M) | 142250.00 |
| Levered Free Cash Flow (M) | -79160.00 |
| Stock Valuation | |
|---|---|
| PE Ratio | 38.77 |
| PEG Ratio | |
| Price to Book value | 8.72 |
| Price to Sales | 0.07 |
| Price to Cash Flow | 0.33 |
| Stock Dividends | |
|---|---|
| Dividend | 0.360 |
| Dividend Yield | 0.02 |
| Dividend Growth | |
